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KURODA TECHNO Co.,Ltd.

KURODA TECHNO Co.,Ltd.

Japanese

Ultrasonic soldering iron SUNBONDER USM-560/USM-540/USM-528

Introduction

Sunbonder is your best choice for flux free, high quality ultrasonic soldering.

In the past, flux and heating were the typical methods to be used for soldering, but Sunbonder introduces a new type of soldering, based on heat and ultrasonic vibrations. The induced cavitation effect replaces need of flux usage as well as the cleaning process, since there’s no exhaust fumes and pollution.

By combining this device with Cerasolzer, the customer can solder on almost of all the materials, for example glass, ceramics, aluminum, molybdenum etc., except for organic substances.

Characteristics

  • Flux
    free

    Provides flux-free soldering. No cleaning process required and no concern of residues.

  • Bonding
    to
    low-solderability
    materials

    Enables bonding to low-solderability materials such as glass, ceramics, and aluminum, which is difficult with conventional soldering methods.

  • Rohs
    compliance

    USM-560 and USM-540 are RoHS compliant products. (*USM-528 is not compliant.) Please click here to see the non-use certificate.

  • Source
    voltage
    for
    oversea use

    Compatible with AC100V-240V for use overseas. We will ask your desired power supply voltage at the time of order and adjust it before shipment.

Solderable area (tip diameter)

The USM-series has three types, each with a different solderable area (tip diameter).

USM-560

Tip size
φ1.0~4.0mm

More

USM-540

Tip size
φ10.00mm

More

USM-528

Tip size
50×10mm

More

This product solves these problems

Case (1) Soldering aluminum

Before adoption Soldering with strong acid flux to remove the aluminum oxide film. Flux cleaning was necessary.
After adoption Ultrasonic soldering method enables flux free soldering, which shortened the manufacturing process.

Case (2) Bonding target materials

Before adoption Soldering with strong acid flux to remove the aluminum oxide film. Flux cleaning was necessary.
After adoption Dramatically reduced indium material loss due to improved variation and voids.

Case (3) Electrode wiring to solar cell glass

Before adoption Bonding with silver paste requires a drying process, and ACF (anisotropic conductive film) is expensive.
After adoption Simplified mass production process results reduction of the material costs.

Solderable material

Compatible with low-solderability materials, such as glass, ceramic, stainless steel, and superconductor wire.
For details, please refer to “Solderable material list“.

Solderable material list

Specification

Model No. USM-560 USM-540 USM-528
Standard price
(Generator+a set of iron)
JPY490,000(Tax excluded) JPY700,000円(Tax excluded) JPY1,250,000(Tax excluded)
Tip size φ1.0~4.0mm φ10.0mm 50mmx10mm
Tip end shape
Generator size 21×23.5×9cm 21×23.5×9cm 26×32×14cm
Generator weight 5kg 5kg 10kg
Packing Dimensions 41×36×22cm 41×36×22cm 60×41×39cm
Gross weight 7.9kg 8.0kg 15.0kg
Ultrasonic frequency 60kHz 40kHz 28kHz
Replaced model USM-Ⅲ/USM-Ⅳ SO-6 USM-28
Max temp 500℃ 600℃ 350℃
Ultrasonic power(max) 12W 12W(at no load)
20W(when soldering)
12W(at no load)
70W(when soldering)
Power 100~240V 100~240V 100~240V
CE mark ×
Instruction manual Download(PDF) Download(PDF) Download(PDF)

Product catalog

From agreement to delivery: flow

Delivery takes approximately 2 weeks after receipt of the order.

1.Inquiry

2.Meeting

3.Proposal and quotation

4.Order and submission of specification confirmation sheet

5.Shipment in approximately 2 weeks

Contact us

+81-45-590-0078

KURODA TECHNO Co.,Ltd.

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KURODA TECHNO Co.,Ltd.

+81-45-590-0078

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