Sputter Target materials
Our ultrasonic soldering technology is used for bonding target materials used in sputtering for FPD, organic EL, and solar cells.
ITO/TCO glass vapor deposited film electrode wiring
Our ultrasonic soldering technology is used not only for bonding the target material of the vapor deposition film, but also for the electrode wiring process to the glass vapor deposition film such as ITO / TCO / CIGS.
Solder coating aluminum motor wire
Aluminum has been considered difficult to solder due to the formation of an oxide film on its surface. The ultrasonic soldering method easily removes oxide film and enables diffusion bonding with aluminum.
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