Ultrasonic dot soldering and CERARIBBON dot bonding tool USK-Dot-1200/6000

Introduction

When attaching electrodes to crystalline wafer substrates or thin-film amorphous silicon substrates, which have low resistance among solar cells, dot soldering of about φ2mm may be used instead of line soldering to reduce material costs.

Characteristics

CERASOLZER
World’s only alloy enabling soldering to glass.
SUNBONDER
Compact ultrasonic soldering device that can remove oxide film without flux.
CERARIBBON
Electrode wiring coated with CERASOLZER, which has good bonding compatibility with CERASOLZER.
Labeler
Supplying tape to fix electrodes to the junction box on the back of the solar cell.
Automation
technology
Applying HDD assembly automation technology, which we have been developed over 40 years, to ultrasonic soldering.
Bonding
process
One stop solution for all the technologies of materials, ultrasonic wave, automation equipment. We can even propose processes.

This product solves these problems

Our ultrasonic soldering tools can perform ultrasonic soldering operations simultaneously with up to 8 heads. In contrast to ultrasonic line soldering, ultrasonic dot soldering requires a longer tact time, but by increasing the number of units that perform ultrasonic soldering simultaneously, the tact time can be shortened.

Results and experience

Optical fiber ferrule bonding	By soldering to the optical fiber, it is used for bonding with the ferrule.
LCOS electrode wiring	It can draw about 20mm solder line with the amount of solder on the iron tip.
Desktop ultrasonic soldering device	Soldering can be done freely on an area of about X:300mm/Y:300mm.

Solderable material

Compatible with low-solderability materials, such as glass, ceramic, stainless steel, and superconductor wire.
For details, please refer to “Solderable material list“.

Solderable material list

Specification

Ultrasonic Dot Soldering tool for PV
USK-Dot-1200

Application	Glass dot soldering
Overview	Pre-supplying solder to the tip of the iron and soldering the object.
Workpiece	Glass substrate □300mm
Ultrasonic wave	60kHz
Soldering material	CERASOLZER ECO #217 (Pb-free melting point 217℃)
Characteristics	Soldering position can be set visually.

Ultrasonic Line Soldering and ribbon bonding tool for PV
USK-Line-8500

Application	Amorphous silicon solar cells
Overview	Pre-supplying solder to the tip of the iron and soldering the object, then bonding copper flat wire.
Workpiece	Glass substrate □500mm
Ultrasonic wave	60kHz
Soldering material	CERASOLZER ECO #217 (Pb-free melting point 217℃)
Characteristics	Mass production tool for electrode wiring with transfer function, high speed tact by 8 heads simultaneous operation.