Ultrasonic Round Target Bonding tool USK-Bonding-1200
Ultrasonic soldering has become the industry standard for bonding sputtering targets.
More than 20 years ago, in response to a request from a target material manufacturer, we started developing and proposing a process for applying indium to the base material by ultrasonic soldering.
At that time, the proposal was manual iron, but as spatter targets for smartphones and televisions were growing, the needs for automation equipment were increasing.
Ultrasonic soldering on a flat base metal
Ultrasonic soldering while rotating a disk-shaped base material
Inserting an ultrasonic soldering iron inside a rotary
Automatically handles everything from preheating of base metal and back plate to ultrasonic soldering and bonding
This product solves these problems
By automating the work that operators have done manually, the system will handle 24 hours production, stabilize quality, and increase production volumes.
Results and experience
|Planer target||Coating the entire surface by moving the iron freely in the XY plane.|
|Rotary target||Coating the inside of the rotary target by inserting the soldering iron into the rotary.|
The following materials can be soldered with this product.
- Cu-Al alloy
- Mn alloy
- Ni alloy
- Co alloy
- Cr alloy
Ultrasonic Circular Target Bonding tool
|Overview||Coating the entire surface of the disk-shaped target material with indium|
|Workpiece||Target material Φ300mm|
|Characteristics||Coating the entire surface while preheating and rotating the disks|
Ultrasonic Planer Target Bonding tool
|Overview||Coating the entire surface of the target material with indium|
|Workpiece||Target material 100mm×300mm|
|Characteristics||Mass production tool with two stages that allows setup even during coating|
From agreement to delivery: flow
Delivery takes approximately 2 to 9 months after ordering, depending on the volume of the device.
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