Ultrasonic Round Target Bonding tool USK-Bonding-1200

Introduction

Ultrasonic soldering has become the industry standard for bonding sputtering targets.
More than 20 years ago, in response to a request from a target material manufacturer, we started developing and proposing a process for applying indium to the base material by ultrasonic soldering.
At that time, the proposal was manual iron, but as spatter targets for smartphones and televisions were growing, the needs for automation equipment were increasing.

Characteristics

Planer
target
coating
Ultrasonic soldering on a flat base metal
Round
target
coating
Ultrasonic soldering while rotating a disk-shaped base material
Rotary
target
coating
Inserting an ultrasonic soldering iron inside a rotary
Automation
line
Automatically handles everything from preheating of base metal and back plate to ultrasonic soldering and bonding

This product solves these problems

By automating the work that operators have done manually, the system will handle 24 hours production, stabilize quality, and increase production volumes.

Results and experience

Planer target	Coating the entire surface by moving the iron freely in the XY plane.
Rotary target	Coating the inside of the rotary target by inserting the soldering iron into the rotary.

Solderable materials

The following materials can be soldered with this product.

Titanium(Ti)
Copper(Cu)
Silver(Ag)
Gold(Au)
Platinum(Pt)
Indium(In)
Nickel(Ni)
Chromium(Cr)
Cobalt(Co)
Tantalum(Ta)
Molybdenum(Mo)
Cu-Al alloy
Mn alloy
Ni alloy
Co alloy
Cr alloy
Zirconium
Hafnium
Mullite
Rhodium
Palladium
ITO
Alumina(Al2O3)
CaO
MgO
SiO2
TiO2
ZnO
ZrO2
CeO2
Si3N3

Specification

Ultrasonic Circular Target Bonding tool
USK-Bonding-1200

Application	Sputtering target
Overview	Coating the entire surface of the disk-shaped target material with indium
Workpiece	Target material Φ300mm
Ultrasonic wave	20kHz
Soldering material	Indium
Characteristics	Coating the entire surface while preheating and rotating the disks

Ultrasonic Planer Target Bonding tool
USK-Bonding-2000

Application	Sputtering target
Overview	Coating the entire surface of the target material with indium
Workpiece	Target material 100mm×300mm
Ultrasonic wave	28kHz
Soldering material	Indium
Characteristics	Mass production tool with two stages that allows setup even during coating