Ultrasonic Dipping with parts scudding ACSS-Scudding-2900

Introduction

This equipment is used to bond electrodes to glass substrates for solar cells, light dimming glass, organic EL, etc.
It is impossible to solder glass using general soldering iron, but our special solders and ultrasonic soldering technology make it possible to solder on glass perfectly.
By bonding copper rectangular wire coated with special solder to the soldered area, it becomes electrode wiring for extracting charge from solar cells and for applying voltage to dimming glass, etc.

Characteristics

• Jet
  flow
  mechanism

  Ensures supply of pure solder at a stable liquid level by lifting the solder from the bottom of the solder tank.

• Nitrogen
  purge

  Increases the surface tension of solder and allows dipping of narrow pitch components without solder bridge.

• Wide
  horn

  Increases part feed speed by applying ultrasonic waves in a wider area

• Roll
  to
  roll

  Continuous material supply

Results and experience