Introduction

This device is a jet-flow ultrasonic soldering tank with ultrasonic vibrations applied from the side, horizontally. Main application is for soldering parts that require dipping in the tank. It enables flux-free soldering, eliminating excessive flux and rendering cleaning process useless. It's possible to use this device for soldering small patterns, or during continuous soldering process.

Soldering tests may be performed on customer's samples.
Please feel free to ask us for more details.

Characteristics

• No need for flux
• No harmful gases released: no need for fume exhaust system
• No need to wash out the flux
• It's possible to solder on aluminum
• Highly precise soldering, no pin-holes
• Best solution for precise patterns soldering
• Continuous soldering possible

Application

Soldering electrode leads

• Pressure membrane IC, HIC
• Low resistance array
• Half-fixed resistance
• Capacitors, varistors
• Liquid crystal displays, coil parts
• Aluminum wires

Pre-soldering

• PCB
• Semiconductor chips
• Connectors, terminals
• All types of leads and electrodes

Mechanical sealing, electric bonding

Specification

• (Above mentioned characteristics may be altered depending on the customer's needs.)

From agreement to delivery: flow

See the flowchart "From agreement to delivery"

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